3

TLV522

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SNOSD27 – MAY 2016

Product Folder Links: TLV522

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should be

current-limited to 10 mA or less.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(4)

Short-circuit to V–.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

Supply voltage, V+ to V–

-0.3

6

V

Signal input pins

Voltage(2)

V- – 0.3

V+ + 0.3

V

Current(2)

–10

10

mA

Output short current

Continuous(4)

Junction temperature

–40

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

all pins(2)

±250

6.3 Recommended Operating Ratings

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply Voltage ( V+– V− )

1.7

5.5

V

Specified Temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

TLV522

UNIT

DGK (VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

182.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

73.6

RθJB

Junction-to-board thermal resistance

104.1

ψJT

Junction-to-top characterization parameter

13.7

ψJB

Junction-to-board characterization parameter

102.5

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A