TLV2352, TLV2352Y

LinCMOS

™ DUAL LOW-VOLTAGE DIFFERENTIAL COMPARATORS

SLCS011B – MAY 1992 – REVISED MARCH 1999

4

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

TLV2352Y chip information

These chips, when properly assembled, display characteristics similar to the TLV2352. Thermal compression

or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip can be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (4) INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

OUT

IN +

IN –

VDD

GND

(8)

(6)

(3)

(2)

(5)

(1)

–

+

(7)

IN +

IN –

OUT

(4)

57

57

(7)

(6)

(5)

(8)

(4)

(3)

(2)

(1)