PACKAGE OPTION ADDENDUM

www.ti.com

29-May-2025

PACKAGING INFORMATION

Orderable part number

Status

(1)

Material type

(2)

Package | Pins

Package qty | Carrier

RoHS

(3)

Lead finish/

Ball material

(4)

MSL rating/

Peak reflow

(5)

Op temp (°C)

Part marking

(6)

5962-9688101QPA

Active

Production

CDIP (JG) | 8

50 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

9688101QPA

TLV2352M

TLV2352ID

Obsolete

Production

SOIC (D) | 8

-

-

Call TI

Call TI

-40 to 85

2352I

TLV2352IDR

Active

Production

SOIC (D) | 8

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

2352I

TLV2352IDR.A

Active

Production

SOIC (D) | 8

2500 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

2352I

TLV2352IP

Active

Production

PDIP (P) | 8

50 | TUBE

Yes

NIPDAU

N/A for Pkg Type

-40 to 85

TLV2352IP

TLV2352IP.A

Active

Production

PDIP (P) | 8

50 | TUBE

Yes

NIPDAU

N/A for Pkg Type

-40 to 85

TLV2352IP

TLV2352IPW

Obsolete

Production

TSSOP (PW) | 8

-

-

Call TI

Call TI

-40 to 85

TY2352

TLV2352IPWR

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

TY2352

TLV2352IPWR.A

Active

Production

TSSOP (PW) | 8

2000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 85

TY2352

TLV2352MJG

Active

Production

CDIP (JG) | 8

50 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

TLV2352MJG

TLV2352MJG.A

Active

Production

CDIP (JG) | 8

50 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

TLV2352MJG

TLV2352MJGB

Active

Production

CDIP (JG) | 8

50 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

9688101QPA

TLV2352M

TLV2352MJGB.A

Active

Production

CDIP (JG) | 8

50 | TUBE

No

SNPB

N/A for Pkg Type

-55 to 125

9688101QPA

TLV2352M

(1) Status: For more details on status, see our product life cycle.

(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,

reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional

waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum

column width.

(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.

Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

Addendum-Page 1