TLC5960

SBVS147 – SEPTEMBER 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION(1)

PRODUCT

PACKAGE-LEAD

PACKAGE DESIGNATOR

ORDERING NUMBER

TLC5960

TSSOP-38

DA

TLC5960DA

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

VALUE

MIN

MAX

UNIT

VIN, CTRL2, CTRL4

–0.3

30

V

S1 to S8, D1 to D8

–0.3

38

V

Voltage(2)

EN, CTRL1, CTRL3, VADJ, VREG5, G1 to G8, XFLT, HVM1 to

–0.3

6.0

V

HVM4

Operating virtual junction, TJ

–40

+150

°C

Temperature

Storage, Tstg

–55

+150

°C

Human Body Model (HBM, JESD22-A114)

2

kV

Electrostatic Discharge Rating(3)

Charged Device Model (CDM. JESD22-C101)

1000

V

Machine Model (MM)

200

V

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

(2)

All voltages are with respect to network ground terminal.

(3)

ESD testing is performed according to the respective JESD22 JEDEC standard.

THERMAL INFORMATION

TLC5960

THERMAL METRIC(1)

DA

UNITS

38 PINS

qJA

Junction-to-ambient thermal resistance

71.2

qJCtop

Junction-to-case (top) thermal resistance

21.8

qJB

Junction-to-board thermal resistance

43.6

°C/W

yJT

Junction-to-top characterization parameter

0.5

yJB

Junction-to-board characterization parameter

38.7

qJCbot

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

DISSIPATION RATINGS

OPERATING FACTOR

TA < +25°C

TA = +70°C

TA = +85°C

PACKAGE

ABOVE TA = +25°C

POWER RATING

POWER RATING

POWER RATING

TSSOP-38 (DA)

14mW/°C

1404mW

770mW

560mW

2

Submit Documentation Feedback

Copyright © 2010, Texas Instruments Incorporated

Product Folder Link(s): TLC5960