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XC9201CCCAL датащи(PDF) 13 Page - Torex Semiconductor

номер детали XC9201CCCAL
подробное описание детали  PWM Controlled Step-Down DC/DC Controllers
PDF  24 Pages
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производитель  TOREX [Torex Semiconductor]
домашняя страница  http://www.torex.co.jp
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XC9201CCCAL датащи(HTML) 13 Page - Torex Semiconductor

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XC9201
Series
5. FB Voltage and CFB
With regard to the XC9201D series, the output voltage is set by attaching externally divided resistors. The output voltage is
determined by the equation shown below according to the values of RFB1 and RFB2. In general, the sum of RFB1 and RFB2
should be 1 MΩor less.
VOUT = 0.9 x (RFB1+ RFB2) / RFB2
The value of CFB (phase compensation capacitor) is approximated by the following equation according to the values of RFB1
and fzfb. The value of fzfb should be 10 kHz, as a general rule.
CFB = 1/(2 x π x RFB1 x fzfb)
Example: When RFB1 = 455 kΩ and RFB2 = 100 kΩ : VOUT = 0.9 x (455 k + 100 k)/100 k = 4.995 V
: CFB= 1/(2 x π x 455 k x 10 k) = 34.98 pF.
■
APPLICATION NOTES
1. The XC9201 series are designed for use with an output ceramic capacitor. If, however, the potential difference between
input and output is too large, a ceramic capacitor may fail to absorb the resulting high switching energy and oscillation
could occur on the output side. If the input-output potential difference is large, connect an electrolytic capacitor in parallel
to compensate for insufficient capacitance.
2. The EXT pin of the XC9201 series is designed to minimize the through current that occurs in the internal circuitry.
However, the gate drive of external PMOS has a low impedance for the sake of speed. Therefore, if the input voltage is
high and the bypass capacitor is attached away from the IC, the charge/discharge current to the external PMOS may lead
to unstable operations due to switching operation of the EXT pin.
As a solution to this problem, place the bypass capacitor as close to the IC as possible, so that voltage variations at the VIN
and VSS pins caused by switching are minimized. If this is not effective, insert a resistor of several to several tens of
ohms between the EXT pin and PMOS gate. Remember that the insertion of a resistor slows down the switching speed
and may result in reduced efficiency.
3. A PNP transistor can be used in place of PMOS. If using a PNP transistor, insert a resistor (RB) and capacitor (CB)
between the EXT pin and the base of the PNP transistor in order to limit the base current without slowing the switching
speed. Adjust RB in a range of 500Ω to 1kΩ according to the load and hFE of the transistor. Use a ceramic capacitor
for CB, complying with CB ≦ 1/ ( 2 x π x RB x Fosc x 0.7), as a rule.
4. This IC incorporates a limit comparator to monitor the voltage produces across the RSEN resistor at the current peak of the
coil. It functions as a limiter when, for example, the output is short-circuited. In such a case, the limit comparator
senses that the voltage across the RSEN resistor has reached a current-limiting voltage (typically 150mV) and outputs a
signal to turn off the external transistor. After sensing a current-limit voltage, the limit comparator typically takes 200nsec
(TYP.) before it turns off the external resistor. During this time, the voltage across the RSEN resistor can exceed the
current-limit voltage, especially when the difference between the input voltage and the output voltage is large and the coil
inductance is small. Therefore, exercise great care in selecting absolute maximum ratings of the external transistor, coil,
and Schottky diode.
5. If the difference between the input voltage and the output voltage is large or small, the switching ON time or OFF time of
this IC becomes short and actual operation can be critically influenced by values of peripheral components 'inductance of
coil, resistance of CLK connection, capacitance of capacitor, etc.) Before use, it is recommended to evaluate this IC
thoroughly with an actual unit.
■
OPERATIONAL EXPLANATION (Continued)
●
Functional Settings (Continued)



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