PACKAGE OPTION ADDENDUM

www.ti.com

23-May-2025

PACKAGING INFORMATION

Orderable part number

Status

(1)

Material type

(2)

Package | Pins

Package qty | Carrier

RoHS

(3)

Lead finish/

Ball material

(4)

MSL rating/

Peak reflow

(5)

Op temp (°C)

Part marking

(6)

SN74LVC2G02DCTR

Active

Production

SSOP (DCT) | 8

3000 | LARGE T&R

Yes

NIPDAU | SN | NIPDAU Level-1-260C-UNLIM

-40 to 125

(2WI5, C02)

(R, Z)

SN74LVC2G02DCTR.B

Active

Production

SSOP (DCT) | 8

3000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 125

(2WI5, C02)

(R, Z)

SN74LVC2G02DCTRE4

Active

Production

SSOP (DCT) | 8

3000 | LARGE T&R

Yes

NIPDAU | NIPDAU

Level-1-260C-UNLIM

-40 to 125

C02

(R, Z)

SN74LVC2G02DCTRE4.B

Active

Production

SSOP (DCT) | 8

3000 | LARGE T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 125

C02

(R, Z)

SN74LVC2G02DCUR

Active

Production

VSSOP (DCU) | 8

3000 | LARGE T&R

Yes

NIPDAU | SN

Level-1-260C-UNLIM

-40 to 125

(C02J, C02Q, C02R)

SN74LVC2G02DCUR.B

Active

Production

VSSOP (DCU) | 8

3000 | LARGE T&R

Yes

SN

Level-1-260C-UNLIM

-40 to 125

(C02J, C02Q, C02R)

SN74LVC2G02DCUT

Active

Production

VSSOP (DCU) | 8

250 | SMALL T&R

Yes

NIPDAU | SN

Level-1-260C-UNLIM

-40 to 125

(C02J, C02Q, C02R)

SN74LVC2G02DCUT.B

Active

Production

VSSOP (DCU) | 8

250 | SMALL T&R

Yes

SN

Level-1-260C-UNLIM

-40 to 125

(C02J, C02Q, C02R)

SN74LVC2G02DCUTG4.B

Active

Production

VSSOP (DCU) | 8

250 | SMALL T&R

Yes

NIPDAU

Level-1-260C-UNLIM

-40 to 125

C02R

SN74LVC2G02YZPR

Active

Production

DSBGA (YZP) | 8

3000 | LARGE T&R

Yes

SNAGCU

Level-1-260C-UNLIM

-40 to 125

CBN

SN74LVC2G02YZPR.B

Active

Production

DSBGA (YZP) | 8

3000 | LARGE T&R

Yes

SNAGCU

Level-1-260C-UNLIM

-40 to 125

CBN

(1) Status: For more details on status, see our product life cycle.

(2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,

reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional

waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum

column width.

(5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.

Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

Addendum-Page 1