QH¶

Seven Segment

SRCLR

QA

QB

QC

QD

QE

QF

QG

QH

g

f

a

b

DP

c

d

e

a

b

c

d

e

f

g

DP

GND

VCC

SER

SRCLK

RCLK

OE

QH¶

SRCLR

QA

QB

QC

QD

QE

QF

QG

QH

GND

VCC

SER

SRCLK

RCLK

OE

Seven Segment

g

f

a

b

DP

c

d

e

a

b

c

d

e

f

g

DP

MCU

R2

C2

R1

C1

VCC

VCC

14

SN74HCS596-Q1

SCLS805 – JUNE 2020

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Product Folder Links: SN74HCS596-Q1

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Copyright © 2020, Texas Instruments Incorporated

9.2 Typical Application

Figure 12. Output Expansion for 7-segment Display control

9.2.1 Design Requirements

•

The 7-segment displays should be common anode

•

The RC values for the SRCLR pin should be chosen such that the signal doesn't reach Vt+(min) until the

supply settles

•

The resistors at the outputs should be chosen such that the total current through the VCC or GND pin doesn't

exceed the maximum value in Absolute Maximum Ratings

•

Follow timing requirements given in Timing Characteristics

9.2.1.1 Power Considerations

Ensure the desired supply voltage is within the range specified in the Recommended Operating Conditions. The

supply voltage sets the device's electrical characteristics as described in the Electrical Characteristics.

The ground must be capable of sinking current equal to the total current to be sunk by all outputs of the

SN74HCS596-Q1 plus the maximum supply current, ICC, listed in Electrical Characteristics. The logic device can

only sink as much current as is provided by the external pull-up resistor or other supply source. Be sure not to

exceed the maximum total current through GND listed in the Absolute Maximum Ratings.

The SN74HCS596-Q1 can drive a load with a total capacitance less than or equal to 50 pF connected to a high-

impedance CMOS input while still meeting all of the datasheet specifications. Larger capacitive loads can be

applied, however it is not recommended to exceed 70 pF.

Total power consumption can be calculated using the information provided in CMOS Power Consumption and

Cpd Calculation.

Thermal increase can be calculated using the information provided in Thermal Characteristics of Standard Linear

and Logic (SLL) Packages and Devices.