MAX3232ECAE datasheet(21/22 Pages) AD

21 / 22 page

±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,

Up to 1Mbps, True RS-232 Transceivers

Selector Guide

PART

NO. OF

DRIVERS/

RECEIVERS

LOW-POWER

SHUTDOWN

GUARANTEED

DATA RATE

(bps)

MAX3222E

2/2

✔

250k

MAX3232E

2/2

—

250k

MAX3237E

(Normal)

5/3

✔

250k

MAX3237E

(MegaBaud)

5/3

✔

MAX3241E

3/5

✔

250k

MAX3246E

3/5

✔

250k

Package Information

For the latest package outline information and land patterns,

go to www.maxim-ic.com/packages. Note that a “+”, “#”, or

“-” in the package code indicates RoHS status only. Package

drawings may show a different suffix character, but the drawing

pertains to the package regardless of RoHS status.

Ordering Information (continued)

PART

TEMP RANGE

PIN-PACKAGE

MAX3232ECTE+

0°C to +70°C

16 TQFN-EP**

(5mm x 5mm)

MAX3232ECUE+

0°C to +70°C

16 TSSOP

MAX3232ECUP+

0°C to +70°C

20 TSSOP

MAX3232EEAE+

-40°C to +85°C

16 SSOP

MAX3232EEWE+

-40°C to +85°C

16 Wide SO

MAX3232EEPE+

-40°C to +85°C

16 Plastic DIP

MAX3232EETE+

-40°C to +85°C

16 TQFN-EP**

(5mm x 5mm)

MAX3232EEUE+

-40°C to +85°C

16 TSSOP

MAX3232EEUP+

-40°C to +85°C

20 TSSOP

MAX3237ECAI+

0°C to +70°C

28 SSOP

MAX3237EEAI+

-40°C to +85°C

28 SSOP

MAX3241ECAI+

0°C to +70°C

28 SSOP

MAX3241ECWI+

0°C to +70°C

28 Wide SO

MAX3241ECUI+

0°C to +70°C

28 TSSOP

MAX3241ECTJ+

0°C to +70°C

32 TQFN-EP**

(7mm x 7mm)

MAX3241EEAI+

-40°C to +85°C

28 SSOP

MAX3241EEWI+

-40°C to +85°C

28 Wide SO

MAX3241EEUI+

-40°C to +85°C

28 TSSOP

MAX3246ECBX-T+

0°C to +70°C

6 x 6 UCSP

†

MAX3246EEBX-T+

-40°C to +85°C

6 x 6 UCSP

†

Denotes a lead(Pb)-free/RoHS-compliant package.

†Requires solder temperature profile described in the Absolute

Maximum Ratings section. UCSP Reliability is integrally linked

to the user’s assembly methods, circuit board material, and

environment. Refer to the UCSP Reliability Notice in the UCSP

Reliability section of this datasheet for more information.

**EP = Exposed pad.

PACKAGE

TYPE

PACKAGE

CODE

OUTLINE

NO.

LAND

PATTERN NO.

20 TQFN

T2055+5

20-0140

90-0010

20 TSSOP

H20+2

21-0066

90-0116

20 SSOP

A20+1

21-0056

90-0094

18 Wide SO

W18+1

21-0042

90-0181

18 PDIP

P18+5

21-0043

—

16 SSOP

A16+2

21-0056

90-0106

16 Wide SO

W16+3

21-0042

90-0107

16 PDIP

P16+1

21-0043

—

16 TQFN

T1655+2

21-0140

90-0072

16 TSSOP

U16+1

21-0066

90-0117

28 SSOP

A28+1

21-0056

90-0095

28 Wide SO

W28+6

21-0042

90-0109

28 TSSOP

U28+2

21-0066

90-0171

32 TQFN

T3277+2

21-0144

90-0125

6x6 HCSP

B36+3

21-0082

Refer to

Application

Note 1891

Chip Information

PROCESS: BICMOS

Maxim Integrated

MAX3222E/MAX3232E/MAX3237E/

MAX3241E/MAX3246E

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