LP3958

SNVS423C – JANUARY 2006 – REVISED MARCH 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

V (SW, FB, MAIN, SUB, KEY1, KEY2, KEY3)

-0.3V to +20V

VDD1, VDD2, VDDIO, VDDA

-0.3V to +6.0V

Voltage on IKEY, IRT, VREF

-0.3V to VDD1+0.3V with 6.0V max

Voltage on Logic Pins

-0.3V to VDDIO +0.3V with 6.0V max

I (VREF)

10µA

I(KEY1, KEY2, KEY3)

100mA

Continuous Power Dissipation (4)

Internally Limited

Junction Temperature (TJ-MAX)

125ºC

Storage Temperature Range

-65ºC to +150ºC

Maximum Lead Temperature (Soldering) (5)

260ºC

ESD Rating (6)

Human Body Model

2kV

Machine Model

200V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150ºC (typ.) and

disengages at TJ=130ºC (typ.).

(5)

For detailed soldering specifications and information, please refer to Application Note AN1112: DSBGA Wafer Level Chip Scale

Package

(6)

The Human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. The machine model is a 200pF

capacitor discharged directly into each pin. MIL-STD-883 3015.7

Operating Ratings

(1) (2)

V (SW, FB, MAIN, SUB)

0 to +19V

VDD1,2

3.0 to 5.5V

VDDIO

1.65V to VDD1

Recommended Load Current (KEY1, KEY2, KEY3) CC Mode

0mA to 15mA/driver

Recommended Total Boost Converter Load Current

0mA to 70mA

Junction Temperature (TJ)

-30ºC to +125ºC

Ambient Temperature (TA)

(3)

-30ºC to +85ºC

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

Thermal Properties

Junction-to-Ambient Thermal Resistance(

θJA)

(1)

60 - 100ºC/W

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

4

Submit Documentation Feedback

Copyright © 2006–2013, Texas Instruments Incorporated

Product Folder Links: LP3958