LMH2191

SNAS485D – JULY 2010 – REVISED MAY 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1) (2)

VBAT - VSS

-0.3V to 6V

Supply Voltage

LVCMOS port IO voltage

-0.3V to (VOUT + 0.3V)

Human Body Model

2000V

ESD Tolerance(3)

Machine Model

200V

Charge Device Model

1000V

LDO

infinite

Output Short Circuit Duration(4)

Clock Output

infinite

For Soldering Information see http://www.ti.com/lit/SNOA549

Storage Temperature Range

−65°C to 150°C

Junction Temperature(5)

150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not specified. For specifications and the test conditions, see

the Electrical Characteristics Tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human body model, applicable std. MIL-STD-883, Method 3015.7. Machine model, applicable std. JESD22–A115–A (ESD MM std of

JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22–C101–C. (ESD FICDM std. of JEDEC)

(4)

Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature

of 1500C.

(5)

The maximum power dissipation is a function of TJ(MAX) , θJA and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC board.

OPERATING RATINGS

(1)

Supply Voltage (VBAT - VSS)

2.5V to 5.5V

Frequency

10 MHz to 52 MHz

Input Clock, SCLK_IN

Duty Cycle

45% to 55%

Temperature Range

-40°C to +85°C

Package Thermal Resistance

θJA

(2)

Board specification: 4LCELLPHONE

Package YFX

153 °C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not specified. For specifications and the test conditions, see

the Electrical Characteristics Tables.

(2)

The maximum power dissipation is a function of TJ(MAX) , θJA and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) - TA)/θJA. All numbers apply for packages soldered directly onto a PC board.

2

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