SILICON CARBIDE

SCHOTTKY BARRIER DIODE

SML02SC06D2A / SML02SC06D2B

Low Leakage

Fast Switching

Low Forward Voltage

Hermetic Ceramic Surface Mount Package

Suitable For General Purpose, Switching Applications

Zero Equivalent Reverse Recovery

Semelab Limited reserves the right to change test conditions, parameter limits and package dimensions without notice.

Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However Semelab

assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to verify that

datasheets are current before placing orders.

Semelab

Semelab Limited

Coventry Road, Lutterworth, Leicestershire, LE17 4JB

Document Number:

Issue:

Page:

10003

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ABSOLUTE MAXIMUM RATINGS (T

A = 25°C unless otherwise stated)

VRRM

Repetitive Peak Reverse Voltage

600V

VRSM

Surge Peak Reverse Voltage

600V

VDC

DC Blocking Voltage

600V

IF(AVG)(1)

Average Forward Current

2A

PD

Total Power Dissipation at TJ = 25°C

5W

Derate Above 25°C

25mW/°C

TJ

Maximum Junction Temperature

225°C

Tstg

Storage Temperature Range

-55 to +225°C

THERMAL PROPERTIES

Symbols

Parameters

Max.

Units

RθJSP(IN)

Thermal Resistance, Junction To Solder Pads TSP = 25°C

40

°C/W

RθJA(PCB)(2) Thermal Resistance, Junction To Ambient, On PCB (small pads)

115

°C/W

RθJA(PCB)(3) Thermal Resistance, Junction To Ambient, On PCB (large pads)

175

°C/W

Notes

(1)

IF is rated at 1.1A @ TA = 25°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where TJ(Max)

does not exceed 225°C; This equates to RθJA(PCB) ≤ 115°C/W.

(2)

PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (25.4mm x 25.4mm) , horizontal in still air.

(3)

PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.067” x 0.105”)‡, (1.70mm x 2.76mm) ‡, horizontal in still air. IF is rated

at 0.8A @ TA = 25°C for PC boards where RθJA(PCB) ≤ 175°C/W. Derate at 4mA/°C above TA = 25°C in this case.

‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.