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LM49150TLEVAL датащи(PDF) 22 Page - Texas Instruments

номер детали LM49150TLEVAL
подробное описание детали  LM49150 Mono Class D Audio Subsystem with Earpiece Driver and Stereo Ground Referenced Headphone Amplifiers
PDF  30 Pages
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производитель  TI2 [Texas Instruments]
домашняя страница  https://www.ti.com
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LM49150TLEVAL датащи(HTML) 22 Page - Texas Instruments

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LM49150, LM49150TLEVAL
SNAS439C – AUGUST 2008 – REVISED MAY 2013
www.ti.com
CHARGE PUMP FLYING CAPACITOR (C1)
The flying capacitor (C1), see Figure 1, affects the load regulation and output impedance of the charge pump. A
C1 value that is too low results in a loss of current drive, leading to a loss of amplifier headroom. A higher valued
C1 improves load regulation and lowers charge pump output impedance to an extent. Above 2.2
μF, the RDS(ON)
of the charge pump switches and the ESR of C1 and Cs5 dominate the output impedance. A lower value
capacitor can be used in systems with low maximum output power requirements.
CHARGE PUMP HOLD CAPACITOR (Cs5)
The value and ESR of the hold capacitor (Cs5) directly affects the ripple on CPVSS. Increasing the value of Cs5
reduces output ripple. Decreasing the ESR of Cs5 reduces both output ripple and charge pump output
impedance. A lower value capacitor can be used in systems with low maximum output power requirements.
LM49150 Demoboard Bill Of Materials
Table 9. Bill Of Materials
Location
Qty
Description
Part Number
Manufacturer
CIN2, CIN1
2
0.22uF, 1206, 10V, X7R Ceramic Capacitor
GRM319R71C224KA01D
Murata
CS4, CS2
2
0.1uF, 0805, 10V, X7R Ceramic Capacitor
GRM219R71C104KA01D
Murata
CS7
1
1.0uF, 0805, 10V, X7R Ceramic Capacitor
GRM21BR71A105KA01L
Murata
CIN3, CIN4
2
1.0uF 1206, 10V, X7R Ceramic Capacitor
GRM319R71C105KAA3D
Murata
CS5, C1
2
2.2uF, 0603, 10V, X7R, Ceramic Capacitor
GRM188R71A225KE15D
Murata
CS1, CS3, CS6
3
2.2uF, Size A, Tantalum Capactior
293D225X9010A2TE3
Vishay
U2
1
LM49150, 16 bump DSBGA
LM49510
TI
R1, R2
2
5K ohm 1/10W 0.05% 0603 SMD
CRCW06035R1KJNEA
Vishay
J11, J12, J13, J14
4
3–Header
J1, J2, J3, J7, J8,
7
2–Header
J9, J10
J6
1
Header_3M 8516–4500PL
U1
1
Headphone Jack
Layout Guidelines
Minimize trace impedance of the power, ground and all output traces for optimum performance. Voltage loss due
to trace resistance between the LM49150 and the load results in decreased output power and efficiency. Trace
resistance between the power supply and the GND of the LM49150 has the same effect as a poorly regulated
supply, increased ripple and reduced peak output power. Use wide traces, for power-supply inputs and amplifier
outputs to minimize losses due to trace resistance, as well as providing heat dissipation from the device. Proper
grounding improves audio performance, minimizes crosstalk between channels and prevents switching noise
from interfering with audio signal. Use of power and ground planes is recommended.
The following recommendations should be considered when laying out the different grounds of the LM49150.
Refer to the Demo Board Schematic for the corresponding component designators. Bypass capacitors for AVDD
(CS7), LSVDD (CS1, CS2), VO(LDO) (CS3, CS4) should be grounded to the GND pin via a ground plane. Bypass
capacitor for CPVSS(CS5) should be grounded via a wide trace or a ground plane to the CPGND pin. The
headphone grounds should be connected to the GND via a separate trace also. This will help prevent noise from
the charge pump from feeding into the power supplies and the output.
Place all digital components and digital signal traces as far as possible from analog components and traces. Do
not run digital and analog traces in parallel on the same PCB layer.
22
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Copyright © 2008–2013, Texas Instruments Incorporated
Product Folder Links: LM49150 LM49150TLEVAL



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