PCF8563

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© NXP Semiconductors N.V. 2015. All rights reserved.

Product data sheet

Rev. 11 — 26 October 2015

27 of 45

NXP Semiconductors

PCF8563

Real-time clock/calendar

11. Limiting values

[1]

Pass level; Human Body Model (HBM), according to Ref. 5 “JESD22-A114”.

[2]

Pass level; Charged-Device Model (CDM), according to Ref. 6 “JESD22-C101”.

[3]

Pass level; latch-up testing according to Ref. 7 “JESD78” at maximum ambient temperature (Tamb(max)).

[4]

According to the NXP store and transport requirements (see Ref. 9 “UM10569”) the devices should be stored at a temperature of +8

C

to +45

C and a humidity of 25 % to 75 %. For long term storage products deviant conditions are described in that document.

Table 28.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

VDD

supply voltage

0.5

+6.5

V

IDD

supply current

50

+50

mA

VI

input voltage

on pins SCL, SDA,

and OSCI

0.5

+6.5

V

VO

output voltage

on pins CLKOUT and INT

0.5

+6.5

V

II

input current

at any input

10

+10

mA

IO

output current

at any output

10

+10

mA

Ptot

total power dissipation

-

300

mW

VESD

electrostatic discharge voltage

HBM

HVSON10 (PCF8563BS/4)

[1] -

3500

V

SO8 (PCF8563T/F4)

[1]

TSSOP8 (PCF8563TS/4)

[1]

SO8 (PCF8563T/5)

[1] -

-

-

-

-

-

2000

V

TSSOP8 (PCF8563TS/5)

[1]

CDM

HVSON10 (PCF8563BS/4)

[2]

2000

V

SO8 (PCF8563T/F4)

[2]

1000

V

SO8 (PCF8563T/5)

[2]

1500

V

TSSOP8 (PCF8563TS/4)

[2]

1500

V

TSSOP8 (PCF8563TS/5)

[2]

1750

V

Ilu

latch-up current

[3] -200

mA

Tstg

storage temperature

[4]

65

+150

C

Tamb

ambient temperature

operating device

40

+85

C