LM3538

SNVS674A – JUNE 2011 – REVISED MAY 2013

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Absolute Maximum Ratings

(1) (2) (3)

VIN_A, VIN_B , VIN_C pin voltage

-0.3V to 6.0V

Voltage on Logic Pins (SCL, SDA, GPO1, GPO2, HWEN, PWM)

-0.3V to (VIN_A+0.3V)

with 6.0V max

LED driver (D1 to D6) Pin Voltages

-0.3V to (VOUT+0.3V)

with 6.0V max

Voltage on All Other Pins

-0.3V to (VIN_A +0.3V) with 6.0V max

Continuous Power Dissipation(4)

Internally Limited

Junction Temperature (TJ-MAX)

150°C

Storage Temperature Range

-40°C to +150° C

Maximum Lead Temperature (Soldering)

See(5)

ESD Rating(6)

Human Body Model

2 kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and

disengages at TJ = 155°C (typ.).

(5)

For detailed soldering specifications and information, please refer to Application Note 1112 (SNVA009): DSBGA Wafer Level Chip Scale

Package (AN-1112).

(6)

The human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin. (MIL-STD-883 3015.7)

Operating Rating

(1) (2)

VIN_A, VIN_B Input Voltage Range

2.7V to 5.5V

LED Voltage Range

2.0V to 4.0V

VIN_C Input Voltage Range (Note: must stay > VOUTLDO + 0.3V)

1.8V to VIN_B

Junction Temperature (TJ) Range

-30°C to +110°C

Ambient Temperature (TA) Range

(3)

−30°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

110°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

Thermal Properties

(1)

Junction-to-Ambient Thermal

Resistance (

θJA),

45°C/W

YFQ0030 Package

(1)

Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design. For more information, please refer to

Application Note 1112 (SNVA009): DSBGA Wafer Level Chip Scale Package (AN-1112).

4

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