LM3532

SNVS653E – JULY 2011 – REVISED AUGUST 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

VIN to GND

V

VSW, VOVP, VILED1, VILED2, VILED3 to GND

V

VSCL, VSDA, VALS1, VALS2, VPWM1, VPWM2, VINT,

V

VHWEN, VT0 to GND

Continuous power dissipation

Internally Limited

Junction temperature , TJ-MAX

150

°C

Maximum lead temperature (soldering, 10s)(4)

300

°C

Storage temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications

(3)

All voltages are with respect to the potential at the GND pin.

(4)

For detailed soldering specifications and information, refer to Application Note AN-1112: DSBGA Wafer Level Chip Scale Package

(SNVA009).

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Electrostatic

V(ESD)

V

discharge

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±5000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

NOM

MAX

UNIT

VIN to GND

2.7

5.5

V

VSW, VOVP, VILED1, VILED2, VILED3 to GND

0

40

V

Junction temperature, TJ

(3) (4)

–40

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 140°C (typical) and

disengages at TJ= 125°C (typical).

(4)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

6.4 Thermal Information

LM3532

THERMAL METRIC(1)

YFQ (DSBGA)

UNIT

16 PINS

RθJA

Junction-to-ambient thermal resistance

61.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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