4

LM397

SNOS977F – MAY 2001 – REVISED MAY 2016

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Copyright © 2001–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ RθJA . All numbers apply for packages soldered directly onto a PCB.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN differential

30

30

V

Supply voltages

±15

30

V

Voltage at input pins

−0.3

30

V

Junction temperature(3)

150

ºC

Soldering

information

Infrared or Convection (20 sec.)

235

ºC

Wave Soldering (10 sec.)

260

ºC

Storage Temperature, Tstg

−65

150

ºC

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2)

±2000

V

Machine Model(1)(2)

±200

(1)

The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ RθJA . All numbers apply for packages soldered directly onto a PCB.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply voltage, VS

5

30

V

Temperature(1)

−40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) – TA)/ RθJA . All numbers apply for packages soldered directly onto a PCB.

6.4 Thermal Information

THERMAL METRIC(1)

LM397

UNIT

DBV (SOT-23)

5 PINS

RθJA

Junction-to-ambient thermal resistance(2)

186

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

92.8

°C/W

RθJB

Junction-to-board thermal resistance

38.9

°C/W

ψJT

Junction-to-top characterization parameter

5.6

°C/W

ψJB

Junction-to-board characterization parameter

38.4

°C/W