11.9 mm

17.0 mm

38.0 mm

L293, L293D

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SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016

10 Power Supply Recommendations

VCC1 is 5 V ± 0.5 V and VCC2 can be same supply as VCC1 or a higher voltage supply with peak voltage up to 36

V. Bypass capacitors of 0.1 uF or greater should be used at VCC1 and VCC2 pins. There are no power up or

power down supply sequence order requirements.

Properly heatsinking the L293 when driving high-current is critical to design. The Rthj-amp of the L293 can be

reduced by soldering the GND pins to a suitable copper area of the printed circuit board or to an external heat

sink.

Figure 14 shows the maximum package power PTOT and the

θJA as a function of the side of two equal square

copper areas having a thickness of 35

μm (see Figure 14). In addition, an external heat sink can be used (see

Figure 12).

During soldering, the pin temperature must not exceed 260°C, and the soldering time must not exceed 12

seconds.

The external heatsink or printed circuit copper area must be connected to electrical ground.

Figure 12. External Heat Sink Mounting Example (

θJA = 25°C/W)

Copyright © 1986–2016, Texas Instruments Incorporated

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Product Folder Links: L293 L293D