L293, L293D

SLRS008D – SEPTEMBER 1986 – REVISED JANUARY 2016

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, VCC1

(2)

36

V

Output supply voltage, VCC2

36

V

Input voltage, VI

7

V

Output voltage, VO

–3

VCC2 + 3

V

Peak output current, IO (nonrepetitive, t ≤ 5 ms): L293

–2

2

A

Peak output current, IO (nonrepetitive, t ≤ 100 µs): L293D

–1.2

1.2

A

Continuous output current, IO: L293

–1

1

A

Continuous output current, IO: L293D

–600

600

mA

Maximum junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Electrostatic

V(ESD)

V

discharge

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC1

4.5

7

Supply voltage

V

VCC2

VCC1

36

VCC1 ≤ 7 V

2.3

VCC1

V

VIH

High-level input voltage

VCC1 ≥ 7 V

2.3

7

V

VIL

Low-level output voltage

–0.3(1)

1.5

V

TA

Operating free-air temperature

0

70

°C

(1)

The algebraic convention, in which the least positive (most negative) designated minimum, is used in this data sheet for logic voltage

levels.

6.4 Thermal Information

L293, L293D

THERMAL METRIC(1)

NE (PDIP)

UNIT

16 PINS

RθJA

Junction-to-ambient thermal resistance (2)

36.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

22.5

°C/W

RθJB

Junction-to-board thermal resistance

16.5

°C/W

ψJT

Junction-to-top characterization parameter

7.1

°C/W

ψJB

Junction-to-board characterization parameter

16.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

The package thermal impedance is calculated in accordance with JESD 51-7.

4

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