TS39101CS datasheet(6/13 Pages) TSC

6 / 13 page

TS39100/1/2/3/4/5

1A Ultra Low Dropout Voltage Regulator

with Multi-Function

6/13

Version: B07

Application Information (Continue)

Enable Input

TS39101/2/3/4/5 versions feature an active-high enable (EN) input that allows ON/OFF control of the regulator.

Current drain reduces to “zero” when the device is shutdown, with only micro-amperes of leakage current. The EN

input has TTL/CMOS compatible thresholds for simple interfacing with logic interfacing. EN may be directly tied to ViN

and pulled up to the maximum supply voltage.

Error Flag

TS39101/3 versions feature an Error Flag, which looks at the output voltage and signals an error condition when this

voltage drops 5% below its expected value. The error flag is an open-collector output that pulls low under fault

conditions. It may sink 10mA. Low output voltage signifies a number of possible problems, including an over-current

fault (the device is in current limit) or low input voltage. The flag output is inoperative during over temperature

shutdown conditions. A pull-up resistor from error flag to either ViN or VOUT is required for proper operation. For

information regarding the minimum and maximum values of pull-up resistance, refer the graph as follow:

Thermal Resistance

Power SOP-8 Thermal Characteristic

TS39101/2/4 series’ performance is its power SOP-8 package featuring half the thermal resistance of a standard SOP-

8 package. Lower thermal resistance means more output current or higher input voltage for a standard SOP-8

package. Lower thermal resistance means more output current or higher input voltage for a given package size.

Lower thermal resistance is achieved by connect the four ground pins with the die attached pad to create a single

piece electrical and thermal conductor. This concept have been used by MOSFET production for years, proving very

reliable and cost effective for the user. As above thermal resistance figure. Thermal resistance consists of two main

elements, ΘJC (junction to case) and ΘCA (case to ambient). Using the power SOP-8 reduces ΘCA, the total thermal

resistance, ΘJA (junction to ambient) is the limiting factor in calculating the maximum power dissipation capability of the

device. Typically, the power SOP-8 have a ΘJC of 20

oC/W dramatically , this is significantly lower than the standard

SOP-8 which is typically 75

oC/W. ΘCA is reduced because pin 5~8 can be soldered directly to a ground plane which

significantly reduces the case to sink and sink to ambient thermal resistance.

TS39101CS датащи(PDF) 6 Page - Taiwan Semiconductor Company, Ltd