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EXAMPLE STENCIL DESIGN

(9.3)

18X (1.27)

20X (0.6)

20X (2)

4220724/A 05/2016

SOIC - 2.65 mm max height

DW0020A

SOIC

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

SYMM

SYMM

1

10

11

20

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:6X