AMC7820

SBAS231B

www.ti.com

2

ELECTRICAL CHARACTERISTICS

At –40

°C to +85°C, AV

DD, DVDD, BVDD = +5V, using external 2.5V reference, unless otherwise noted.

ABSOLUTE MAXIMUM RATINGS(1)

AVDD, DVDD, BVDD to GND .................................................. –0.3V to +6V

Digital Input Voltage to GND ................................. –0.3V to BVDD + 0.3V

Analog Input Voltage to GND ................................ –0.3V to AVDD + 0.3V

Input Current: Continuous ..............................................................

±20mA

Momentary ............................................................

±100mA

Operating Temperature Range ...................................... –40

°C to +105°C

Storage Temperature Range ......................................... –65

°C to +150°C

Junction Temperature (TJ Max) .................................................... +150°C

TQFP Package

Power Dissipation ....................................................... (TJ Max – TA)/θJA

θ

JC Thermal Impedance ............................................................. 15°C/W

θ

JA Thermal Impedance ............................................................. 60°C/W

Lead Temperature (soldering)

Vapor Phase (60s) .................................................................. +220

°C

Infrared (15s) ........................................................................... +220

°C

NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”

may cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

SPECIFIED

SPECIFIED

PACKAGE

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR(1)

RANGE

MARKING

NUMBER

MEDIA, QUANTITY

AMC7820Y

TQFP-48

PFB

–40

°C to +85°C

AMC7820Y

AMC7820Y/250

Tape and Reel, 250

AMC7820Y

““

“

AMC7820Y

AMC7820Y/2K

Tape and Reel, 2000

PACKAGE/ORDERING INFORMATION

PARAMETER

CONDITION

MIN

TYP

MAX

UNITS

ADC ANALOG INPUTS(1)

Channels 2-5

Input Voltage Range

02 • VREF

V

Input Impedance

5M

Ω

Input Capacitance

15

pF

Input Leakage Current

±1

µA

ADC

Resolution

12

Bits

No Missing Codes

12

Bits

Integral Linearity

±1

±2

LSB(2)

Differential Linearity

±1LSB

Offset Error

±2

±5LSB

Offset Error Drift

±4

ppm/

°C

Offset Error Match

Channels 2-5

0.5

1

LSB

Gain Error

±0.3

±1.5

%

Gain Error Match

Channels 2-5

0.3

1

LSB

Noise

150

µVrms

Power-Supply Rejection

+AVDD, +DVDD = +5V ±5%

1.2

LSB

Throughput Rate

100

kHz

Total Conversion Time

Scan All 8 Channels

80

µs

DAC(3)

Output Voltage Range

DAC_OUT_SET Connected to DAC_OUT

0

VREF

V

DAC_OUT_SET = AGND

0

2 • VREF

V

Output Current

Refer to the Characteristic Curves

±1mA

Resolution

12

Bits

Integral Linearity(4)

±4

±8LSB

Monotonicity

12

Bits

Differential Linearity

±0.1

±1LSB

Offset Error

Output Range 0 – VREF

±0.5

±5mV

Output Range 0 – 2 • VREF

±1

±10

mV

Offset Error Drift

±4

ppm/

°C

Gain Error

Output Range = 0V to 2 • VREF or 0V to VREF

±0.3

±1.5

%

Settling Time

Step Between Codes 1024 and 2048

3

µs

Code Change Glitch Impulse

1LSB Change Around Major Carry

20

nV-s

THERMISTOR CURRENT SOURCE

Output Current Range

10

100

1000

µA

Output Current Accuracy

RISET = 100kΩ

98

102

µA

Output Impedance

RISET = 100kΩ

500

M

Ω

Compliance Voltage

03

V

Power-Supply Rejection Ratio

60

dB

AMC7820

NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.