DATA SHEET • SE2623L-R: 2.4 GHz HIGH POWER WIRELESS LAN POWER AMPLIFIER

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

202397J • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 11, 2020

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Evaluation Board Description

The SE2623L-R-EK1 Evaluation Board is used to test the

performance of the SE2623L-R PA. A typical application

schematic diagram is provided in Figure 4. Table 8 provides the

Bill of Materials (BOM) list for Evaluation Board components. A

photograph of the Evaluation Board is shown in Figure 5.

Evaluation Board Test Procedure

1. Connect GND to all ground pins.

2. Connect a power supply to the VCC1, VCC2, and the two

RF_OUT pins.

3. If desired, connect a voltage meter to the VDET pin.

4. Connect a +3.3 V supply to EN pin.

5. Connect a signal generator to the RF signal input port. Set it to

the desired RF frequency at a power level of –30 dBm or less

to the Evaluation Board. DO NOT enable the RF signal.

6. Connect a spectrum analyzer to the RF signal output port.

7. Enable the power supply.

8. Enable the RF signal.

9. Take measurements.

CAUTION: If the input signal exceeds the rated power, the

Evaluation Board can be permanently damaged.

NOTE: It is important to adjust the VCC voltage source so that the

target supply voltage (+5) is measured at the board. The

high collector currents will drop the collector voltage

significantly if long leads are used. Adjust the bias voltage

to compensate.

Circuit Design Considerations

The following design considerations are general in nature and

must be followed regardless of final use or configuration:



Paths to ground should be made as short as possible.



The ground pad of the SE2623L-R has special electrical and

thermal grounding requirements. This pad is the main

thermal conduit for heat dissipation. Since the circuit board

acts as the heat sink, it must shunt as much heat as possible

from the device.

Therefore, design the connection to the ground pad to

dissipate the maximum wattage produced by the circuit

board. Multiple vias to the grounding layer are required.

For further information, refer to the Skyworks Application

Note, PCB Design Guidelines for High Power Dissipation

Packages, document number 201211.



Bypass capacitors should be used on the DC supply lines. An

RF inductor is required on the VCC supply line to block RF

signals from the DC supply. Refer to the schematic drawing

in Figure 4 for further details.



The RF lines should be well separated from each other with

solid ground in between traces to maximize input-to-output

isolation.