PLDS30J

Taiwan Semiconductor

2

Version: C2502

THERMAL PERFORMANCE

PARAMETER

SYMBOL

TYP

UNIT

Junction-to-lead thermal resistance

RӨJL

1.5

°C/W

Junction-to-ambient thermal resistance

RӨJA

5.5

°C/W

Junction-to-case thermal resistance

RӨJC

1.2

°C/W

Thermal Performance Note: Mounted on Heat sink with 4" x 6" x 0.25" Al-Plate

ELECTRICAL SPECIFICATIONS (T

A

= 25°C unless otherwise noted)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX

UNIT

Forward voltage (1)

IF = 15A, TJ = 25°C

VF

0.90

-

V

IF = 30A, TJ = 25°C

0.94

1.00

V

IF = 15A, TJ = 125°C

0.78

-

V

IF = 30A, TJ = 125°C

0.87

-

V

Reverse current @ rated VR(2)

TJ = 25°C

IR

-

10

µA

TJ = 125°C

0.5

-

µA

Junction capacitance

1MHz, VR = 4.0V

CJ

177

-

pF

Reverse recovery time

IF = 0.5A, IR = 1.0A,

Irr = 0.25A

trr

1140

-

ns

Notes:

1.

Pulse test with PW = 0.3ms

2.

Pulse test with PW = 30ms

ORDERING INFORMATION

ORDERING CODE

PACKAGE

PACKING

PLDS30J

D2PAK-D

800 / Tape & Reel