21

DF40 Series/0.4mm Pitch, 1.5 to 4.0mm Height, Board-to-Board/FPC-to-Board Connector

Precautions

Recommended

Temperature

Profile

50

60sec. Max.

100

150

200

250

Heating Time （sec.）

Temperature（℃）

0

100

150

200

250

50

Normal

Temperature

300

90 to 120sec.

180℃

250℃

220℃

150℃

【Conditions】

1.　Peak Temperature : 250℃

2.　Heating : 220℃ Min. for 60 sec. Max.

3.　Preheating : 150 to 180℃, 90 to 120 sec.

4.　Number of Reflow Cycles : 2 cycles Max.

* Temperature refers to the surface temperature of

the board near the connector lead.

We recommend reflow mounting in a nitrogen environment.

Recommended

Manual

Soldering

Conditions

Soldering iron temperature : 340 ± 10℃ , Soldering Time : Within 3 sec.

Recommended

Metal Mask

Thickness and

Open Area to

PCB Pattern

(Area Ratio)

Thickness : 0.12mm, Aperture Ratio : DS 80%　DP 80%

Board

Warpage

Max. of 0.02mm at the center in reference to both ends of the connector

Cleaning

Cleaning is not recommended.

If you clean this product, please evaluate its performance before using it.

(Cleaning may impair the mating/unmating properties and lower resistance to environmental factors.)

Precautions

■ Be careful when mating/unmating the connector when it is not mounted on the PCB as it may cause damage/

deformation to contacts.

■ Avoid supporting the PCB only with the connectors. Support it by other means such as bolts, screws, posts, etc.

■ Excessive prying during unmating/mating may result in damage.

■ In the case of hand soldering, please do not apply any flux which could cause flux wicking.

■ This product may have slight color differences due to production lot variability, but this does not affect the

performance.

■ Please refer to the following page for handling precautions when inserting and removing.

■ Because the product can disengage if dropped (or other impact), or by FPC routing, it is advised to secure the

mated connectors to the board with housings and cushioning materials.