Matters to Be Observed When Using This Product

■ The heat-resistant temperature of a capacitor varies

depending on the type of a dielectric film used and on

the structure and manufacturing method of the capacitor.

When mounting the capacitor on a board, set the mounting

temperature such that the internal temperature of the

capacitor (see the figure on the right) is equal to or lower

than the mounting heat-resistant temperature listed in the

following table.

When a capacitor is sent through a high-temperature atmosphere after being subjected to the (flow) soldering process,

check the mounting temperature including the temperature of the capacitor in the high-temperature atmosphere.

■ Set temperature conditions for soldering within the ranges

shown in the graph on the right (make sure to confirm that the

set temperature conditions are equal to or lower than the mounting

heat-resistant temperature because temperature conditions vary

significantly depending on the equipment structure).

Carry out no more than two soldering cycles and in such a way

that the second soldering cycle is only carried out after the

capacitor temperature returns to a normal temperature following

the end of the first cycle.

<Condition example>

■ Since the mounting heat-resistant temperature of the capacitor is low, avoid running the capacitor through an adhesive

curing oven for fixing chip components. In the oven, the capacitor is exposed to heat higher than the mounting

heat-resistant temperature, which causes the dielectric film to thermally shrink, thus causing a short failure.

■ When a film capacitor is used with chip components, mount the film capacitor and solder it after the adhesive has cured.

■ Do not perform reflow soldering for the capacitor. During reflow soldering, if heat higher than the mounting

heat-resistant temperature is applied to the capacitor, it could damage the exterior resin and impair the capacitor

characteristics.

23-Apr-25

Capacitor body

There is a certain type of capacitor that must be lifted

upward from the printed board.

(processed product)

Preheating

At 120 ℃ or less for 1 minute or less

(the preheating time and final temperature reached

around the land on the back of the board)

Polyester-based

ECQE(F)

―

120 ℃

ECQE(B), ECQE(T), ECQUL, ECQUG

160 ℃

―

ECWFD 450 V

135 ℃

―

ECQUA, ECWFE 450 V

125 ℃

―

ECWF(L) 400 V / 0.12 μF to 2.4 μF,

ECWF(L) 630 V / 0.047 μF to 1.3 μF,

ECWFE 630 V, ECWFG 600 to 1100 V, ECWFJ 800 V, 1100 V

145 ℃

125 ℃

ECWH(A), ECWH(V), ECWFD 630 V

135 ℃

125 ℃

　 Mounting conditions (lead-type) * Target capacitors: ECQE, ECWF, ECWH, and ECQU

Printed circuit board

Board thickness of 0.8 mm or more

ECWH(C)

140 ℃

125 ℃

Dielectric material

Type

Mounting heat-resistant temperature (peak value)

Measurement position A Measurement position B

Polypropylene-

based

ECWF(L) 400 V / 0.022 μF to 0.11 μF,

ECWF(L) 630 V / 0.01 μF to 0.043 μF, ECWF(A)

135 ℃

125 ℃

Metal

Capacitor

Thermocouple (ø 0.1)

(measurement position A: metal-sprayed part)

Thermocouple (ø 0.1)

(measurement position B: capacitor element interior)

Solder iron

Solder dipping

400

380

360

340

320

300

280

260

240

220

0 1 2 3 4 5 6 7 8

Soldering time (s)