TUAS3D

– TUAS3M

Taiwan Semiconductor

2

Version: A2406

THERMAL PERFORMANCE

PARAMETER

SYMBOL

TYP

UNIT

Junction-to-lead thermal resistance

RӨJL

5.4

°C/W

Junction-to-ambient thermal resistance

RӨJA

46

°C/W

Junction-to-case thermal resistance

RӨJC

8.9

°C/W

Thermal Performance Note: Units mounted on PCB (16mm x 16mm Cu pad test board)

ELECTRICAL SPECIFICATIONS (T

A

= 25°C unless otherwise noted)

PARAMETER

CONDITIONS

SYMBOL

TYP

MAX

UNIT

Forward voltage(1)

IF = 1.5A, TJ = 25°C

VF

0.88

-

V

IF = 3.0A, TJ = 25°C

0.94

1.10

V

IF = 1.5A, TJ = 125°C

0.76

-

V

IF = 3.0A, TJ = 125°C

0.83

-

V

Reverse current @ rated VR(2)

TJ = 25°C

IR

-

5

µA

TJ = 125°C

11

-

µA

Junction capacitance

TUAS3D

TUAS3G

TUAS3J

1MHz, VR = 4.0V

CJ

27

-

pF

TUAS3K

TUAS3M

24

-

Notes:

1.

Pulse test with PW = 0.3ms

2.

Pulse test with PW = 30ms

ORDERING INFORMATION

ORDERING CODE(1)

PACKAGE

PACKING

TUAS3x

TO-277A (SMPC4.6U)

6,000 / Tape & Reel

Notes:

1.

“x” define voltage from 200V(TUAS3D) to 1000V(TUAS3M)