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ADRF5142BCCZN-R7 датащи(PDF) 9 Page - Analog Devices |
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ADRF5142BCCZN-R7 датащи(HTML) 9 Page - Analog Devices |
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9 / 10 page ![]() Data Sheet ADRF5142 APPLICATIONS INFORMATION analog.com Rev. 0 | 9 of 10 The ADRF5142 has two power supply pins (VDD and VSS) and one control pin (CTRL). Figure 13 shows the external components and connections for the supply and control pins. The VDD pin is decoupled with 100 pF and 100 nF multilayer ceramic capacitors. The VSS and control pins are decoupled with 100 pF multilayer ceramic capacitors. The device pinout allows the placement of the decoupling capacitors close to the device. No other external components are needed for bias and operation, except DC-blocking capacitors on the RF pins when the RF lines are biased at a voltage different than 0 V. For more details, see the Pin Configuration and Function Descriptions section. Figure 13. Recommended Schematic RECOMMENDATIONS FOR PCB DESIGN The RF ports are matched to 50 Ω internally, and the pinout is designed to mate a coplanar waveguide (CPWG) with a 50 Ω char- acteristic impedance on the PCB. Figure 14 shows the referenced CPWG RF trace design for an RF substrate with 8 mil thick Rogers RO4003 dielectric material. An RF trace with 14 mil width and 7 mil clearance is recommended for 1.5 mil finished copper thickness. Figure 14. Example PCB Stack Up Figure 15 shows the routing of the RF traces, supply, and control signals from the device. The ground planes are connected with as many filled as allowed through vias for optimal RF and thermal performance. The primary thermal path for the device is the bottom side, and therefore, a heatsink is required under the PCB to ensure maximum heat dissipation and to reduce thermal rise on the PCB during high-power applications. Figure 15. PCB Routings Figure 16 shows the recommended layout from the device RF pins to the 50 Ω CPWG on the referenced stackup. PCB pads are drawn 1:1 to device pads. The ground pads are drawn as soldermask defined. The signal pads are drawn as pad defined. The RF trace from the PCB pad is extended with the same width up to the package edge and tapered to an RF trace with a 45° angle. The paste mask is also designed to match the pad without any aperture reduction. The paste is divided into multiple openings for the paddle. Figure 16. Recommended RF Pin Transitions For further recommendations and alternate PCB stackups with different dielectric thickness and CPWG design, contact Analog Devices, Inc., Technical Support Request. |
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