Data Sheet

ADRF5010

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 5 of 12

For recommended operating conditions, see Table 1.

Table 3. Absolute Maximum Ratings

Parameter

Rating

Positive Supply Voltage

−0.3 V to +3.6 V

Negative Supply Voltage

−3.6 V to +0.3 V

Digital Control Input1

Voltage

−0.3 V to VDD + 0.3 V

Current

3 mA

RF Input Power, Dual Supply2 (VDD = 3.3 V, VSS =

−3.3 V, f = 0.1 GHz to 55 GHz, TCASE = 85°C3)

Through Path

37 dBm

Terminated Path

33.5 dBm

Hot Switching (RF1/2 to Termination)

33.5 dBm

RF Input Power, Single Supply (VDD = 3.3 V, VSS

= 0 V, f = 0.1 GHz to 55 GHz, TCASE = 85°C3)

Through Path

20 dBm

Terminated Path

20 dBm

Hot Switching (RF1/2 to Termination)

20 dBm

RF Input Power, Unbiased

(VDD, VSS = 0 V)

30 dBm

Temperature

Junction, TJ

135°C

Storage

−65°C to +150°C

Reflow

260°C

1 Overvoltages at the digital control input are clamped by internal diodes.

Current must be limited to the maximum rating given.

2 For power derating over frequency, see Figure 2.

3 For 105°C operation, the power handling degrades from the TCASE = 85°C

specification by 3 dB for dual supply.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

Only one absolute maximum rating can be applied at a time.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction-to-case bottom (channel-to-package bottom)

thermal resistance.

Table 4. Thermal Resistance

Package Type

θJC1

Unit

CC-14-5

Through Path

135

°C/W

Terminated Path

50

°C/W

1 θJC was determined by simulation under the following conditions: The heat

transfer is due solely to the thermal conduction from the channel through the

ground pad to the PCB, and the ground pad is held constant at the operating

temperature of 85°C.

POWER DERATING CURVES

Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C