BMP384 datasheet(53/58 Pages) BOSCH

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Bosch Sensortec | BMP384 Datasheet

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Modifications reserved |Data subject not change without notice | Printed in Germany

Document number: BST-BMP384-DS003-11 Revision_1.0_112020

7.6.

Mounting and assembly recommendations

In addition to “Handling, soldering & mounting instructions BMP38x”, the following recommendations should be taken into

consideration when mounting a pressure sensor on a printed-circuit board (PCB):

•

The clearance above the metal lid shall be 0.1mm at minimum.

•

For the device housing appropriate venting needs to be provided in case the ambient pressure shall be measured.

•

Liquids shall not come into direct contact with the device.

•

No hard residues are allowed on the gel surface, neither during installation nor over life time.

•

During operation the sensor chip is sensitive to light, which can influence the accuracy of the measurement (photo-

current of silicon). The position of the vent hole minimizes the light exposure of the sensor chip. Nevertheless, BST

recommends to avoid the exposure of BMP384 to strong light sources.

•

Soldering must not be done using vapor phase processes since the sensor might be damaged.

7.7.

Environmental safety

7.7.1. RoHS

The BMP384 sensor meets the requirements of the EC restriction of hazardous substances (RoHS) directive, see also:

Directive 2015/863 (amending Annex II to Directive 2011/65/EU) of the European Parliament and of the Council on the

restriction of the use of certain hazardous substances in electrical and electronic equipment..

7.7.2. Halogen content

The BMP384 is halogen-free. For more details on the analysis results please contact your Bosch Sensortec representative.

7.7.3. Internal package structure

BMP384 with its new package design concept has a coverage of the inner components with gel, which protects sensing

structure, and internal components from environmental conditions1 such as dust and liquid components.

Within the scope of Bosch Sensortec’s ambition to improve its products and secure the mass product supply, Bosch

Sensortec qualifies additional sources (e.g. 2nd source) for the LGA package of the BMP384.

While Bosch Sensortec took care that all of the technical package parameters described above are 100% identical for all

sources, there can be differences in the chemical content and the internal structural between the different package sources.

However, as secured by the extensive product qualification process of Bosch Sensortec, this has no impact to the usage or

to the quality of the BMP384 product.

BMP384 датащи(PDF) 53 Page - Bosch Sensortec GmbH