Data Sheet

ADPL42005

analog.com

Rev. 0

23 of 26

OUTLINE DIMENSIONS

Figure 51. 8-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body and 0.75 mm Package Height (CP-8-11)

Dimensions shown in millimeters

Figure 52. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP] Narrow Body (RD-8-1). Dimensions shown

in millimeters

2.44

2.34

2.24

0.30

0.25

0.20

0.80

0.75

0.70

1.70

1.60

1.50

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

3.10

3.00 SQ

2.90

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

JEDEC STANDARDS MO-229-W3030D-4

0.20 MIN

8

1

5

4

TOP VIEW

SIDE VIEW

EXPOSED

PAD

BOTTOM VIEW

P IN 1

IN DI CAT O R AR E A OP T IO NS

(SEE DETAI L A)

1

DETAIL A

(JEDEC 95)

PIN 1 INDEX

AREA

SEATING

PLANE

TOP VIEW

SIDE VIEW

COMPLIANT TO JEDEC STANDARDS MS-012-AA

0.356

0.457

4.00

3.90

3.80

6.20

6.00

5.80

5.00

4.90

4.80

0.10 MAX

0.05 NOM

3.81 REF

8°

0°

45°

1.04 REF

8

1

4

5

1.75

1.35

1.65

1.25

2.39

2.29 SQ

2.19

0.51

0.31

0.50

0.25

1.27

0.40

0.25

0.17

COPLANARITY

0.10

1.27

BSC

BOTTOM VIEW

END VIEW

SEATING

PLANE

EXPOSED

PAD