Data Sheet Rev. B, September 2020 | Subject to change without notice

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ACT4529M

40 V/3.0 A CV/CC Buck Converter Featuring QC2.0, USB Auto-Detect and USB-PD

APPLICATIONS INFORMATION

PCB Layout Guidance

When laying out the printed circuit board, the following

checklist should be used to ensure proper operation of

the IC.

1.

Arrange the power components to reduce the AC

loop size consisting of CIN, VIN pin, SW pin and the

Schottky diode and GND.

2.

Place input decoupling ceramic capacitor CIN as

close to VIN pin as possible. The GND side of CIN

must be placed as close as possible to to power

GND on the top layer. The traces should be short

and wide.

3.

The high power loss components, e.g. the controller,

Schottky diode, and the inductor should be placed

carefully to make the thermal spread evenly on

the board.

4.

Schottky anode pad and IC exposed pad should be

placed close to ground clips in CLA applications

5.

Use “Kelvin” or “4-wire” connection techniques from

the sense resistor pads directly to the CSP and

CSN pins. The CSP and CSN traces should be in

parallel to avoid interference.

6.

Place multiple vias between top and bottom GND

planes for best heat dissipation and noise immunity.

7.

Use short traces connecting HSB-CHSB-SW loop.

8.

SW node is noisy, switching from VIN to GND. Its

size should be minimized and it should be isolated

away from the rest of circuit for good EMI and low

noise operation.

Example PCB Layout