 2018 Microchip Technology Inc.

DS20005991A-page 21

ATA6560/1

8-Lead Very Thin Plastic Dual Flat, No Lead Package (Q8B) - 3x3 mm Body [VDFN] With

2.40x1.60 mm Exposed Pad and Stepped Wettable Flanks

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging.

Microchip Technology Drawing C04-21358 Rev B Sheet 2 of 2

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E2

A3

e

L

E

N

0.65 BSC

0.203 REF

1.50

0.35

0.25

0.80

0.00

0.30

0.40

1.60

0.85

0.03

3.00 BSC

MILLIMETERS

MIN

NOM

8

1.70

0.45

0.35

0.90

0.05

MAX

K-

0.20

-

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1.

2.

3.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Terminal-to-Exposed-Pad

Overall Length

Exposed Pad Length

D

D2

2.30

3.00 BSC

2.40

2.50

A4

E3

SECTION A–A

PARTIALLY

PLATED

Wettable Flank Step Cut Depth

A4

0.10

0.13

0.15

E3

-

-0.04

Wettable Flank Step Cut Width