ADP151 datasheet(5/23 Pages) AD

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Data Sheet

ADP151

ABSOLUTE MAXIMUM RATINGS

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Rev. J | 5 of 23

Table 3.

Parameter

Rating

VIN to GND

−0.3 V to +6.5 V

VOUT to GND

−0.3 V to VIN

EN to GND

−0.3 V to +6.5 V

Temperature Range

Storage

−65°C to +150°C

Operating Junction

−40°C to +125°C

Operating Ambient

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in combina-

tion. The ADP151 can be damaged when the junction temperature

limits are exceeded. Monitoring ambient temperature does not

guarantee that TJ is within the specified temperature limits. In appli-

cations with high power dissipation and poor thermal resistance, the

maximum ambient temperature may have to be derated.

In applications with moderate power dissipation and low printed

circuit board (PCB) thermal resistance, the maximum ambient tem-

perature can exceed the maximum limit as long as the junction

temperature is within specification limits. TJ of the device is depend-

ent on TA, the power dissipation of the device (PD), and the junction

to ambient thermal resistance of the package (θJA).

To calculate the maximum TJ from TA and PD use the following

equation:

TJ = TA + (PD × θJA)

The θJA of the package is based on modeling and calculation using

a 4-layer board. θJA is highly dependent on the application and

board layout. In applications where high maximum PD exists, close

attention to thermal board design is required. The value of θJA

may vary, depending on PCB material, layout, and environmental

conditions. The specified values of θJA are based on a 4-layer,

4 inches × 3 inches circuit board. See JESD51-7 and JESD51-9

for detailed information on the board construction. For additional

information, see the AN-617 Application Note, MicroCSP™ Wafer

Level Chip Scale Package.

ΨJB is the junction to board, thermal characterization parameter

with units of °C/W. ΨJB of the package is based on modeling

and calculation using a 4-layer board. The JESD51-12, Guidelines

for Reporting and Using Electronic Package Thermal Information,

states that thermal characterization parameters are not the same as

thermal resistances. ΨJB measures the component power flowing

through multiple thermal paths rather than a single path as in θJB.

Therefore, ΨJB thermal paths include convection from the top of

the package as well as radiation from the package, factors that

make ΨJB more useful in real-world applications. To calculate the

maximum TJ from the board temperature (TB) and PD, use the

following equation:

TJ = TB + (PD × ΨJB)

See JESD51-8 and JESD51-12 for more detailed information about

ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

ΨJB

Unit

5-Lead TSOT (UJ-5)

170

°C/W

4-Ball WLCSP (CB-4-3)

260

°C/W

6-Lead LFCSP (CP-6-3)

63.6

28.3

°C/W

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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