HS-201HSRH, HS-201HSEH

FN4874 Rev 4.01

Page 2 of 6

May 8, 2024

Ordering Information

ORDERING SMD

NUMBER

(Note 2)

INTERNAL

PART NUMBER

(Note 1)

RADIATION HARDNESS

(Total Ionizing Dose)

PACKAGE DESCRIPTION

(RoHS COMPLIANT)

PKG.

DWG. #

TEMP. RANGE

5962F9961801VEC

HS1-201HSRH-Q

HDR to 300krad(Si)

16 Ld SBDIP

D16.3

-55 to +125°C

5962F9961802VEC

HS1-201HSEH-Q

HDR to 300krad(Si)

LDR to 50krad(Si)

5962F9961801QEC

HS1-201HSRH-8

HDR to 300krad(Si)

5962F9961801VXC

HS9-201HSRH-Q

HDR to 300krad(Si)

16 Ld Flatpack

K16.A

5962F9961802VXC

HS9-201HSEH-Q

HDR to 300krad(Si)

LDR to 50krad(Si)

5962F9961801QXC

HS9-201HSRH-8

HDR to 300krad(Si)

5962F9961801V9A

HS0-201HSRH-Q (Note 4)

HDR to 300krad(Si)

Die

-

5962F9961802V9A

HS0-201HSEH-Q (Note 4)

HDR to 300krad(Si)

LDR to 50krad(Si)

N/A

HS1-201HSRH/PROTO (Note 3)N/A

16 Ld SBDIP

D16.3

HS9-201HSRH/PROTO (Note 3)

16 Ld Flatpack

K16.A

HS0-201HSRH/SAMPLE (Notes 3, 4)Die

-

NOTES:

1. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both

SnPb and Pb-free soldering operations.

2. Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The listed SMD numbers must be

used when ordering.

3. /PROTO and /SAMPLE note - The /PROTO and /SAMPLE are not rated or certified for Total Ionizing Dose (TID) or Single Event Effect (SEE) immunity.

These parts are intended for engineering evaluation purposes only. The /PROTO parts meet the electrical limits and conditions across temperature

specified in the DLA SMD and are in the same form and fit as the qualified device. The /SAMPLE parts can meet the electrical limits and conditions

specified in the DLA SMD. The /SAMPLE parts do not receive 100% screening across temperature to the DLA SMD electrical limits. These part types

do not come with a Certificate of Conformance because they are not DLA qualified devices.

4. Die product tested at TA = + 25°C. The wafer probe test includes functional and parametric testing sufficient to make the die capable of meeting the

electrical performance outlined in the SMD.