AD8372

Rev. 0 | Page 6 of 16

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

5.5 V

ENB1, ENB2, SDI1, SDI2, SDO1, SDO2,

CLK1, CLK2, LCH1, LCH2

V p-p

Internal Power Dissipation

1.4 W

34.6°C/W1, 2

3.6°C/W2

Maximum Junction Temperature

150°C

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

pad soldered to the board and thermal vias in the board.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION