CMS14

2006-11-13

1

TOSHIBA Schottky Barrier Diode

CMS14

Switching Mode Power Supply Applications

(Output voltage:

≤12 V)

DC/DC Converter Applications

• Suitable for compact assembly due to small surface-mount package

Characteristics

Symbol

Rating

Unit

Repetitive peak reverse voltage

60

V

Average forward current

2.0 (Note 1)

A

Non-repetitive peak surge current

40 (50 Hz)

A

Junction temperature

−40~150

°C

Storage temperature range

−40~150

°C

Note 1: Tℓ

= 112°C

Device mounted on a ceramic board

Board size: 50 mm

× 50 mm

Soldering size: 2 mm

× 2 mm

Board thickness: 0.64 t

Rectangular waveform (

Note 2: Using continuously under heavy loads (e.g. the application of

high temperature/current/voltage and the significant change in

temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating

conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Characteristics

Symbol

Test Condition

Min

Typ.

Max

Unit

⎯

0.45

⎯

Peak forward voltage

⎯

0.53

0.58

V

⎯

0.6

⎯

Peak repetitive reverse current

⎯

25

200

μA

Junction capacitance

⎯

77

⎯

pF

Device mounted on a ceramic board

(board size: 50 mm

× 50 mm)

(soldering land: 2 mm

× 2 mm)

(board thickness: 0.64 t)

⎯

⎯

60

Device mounted on a glass-epoxy board

(board size: 50 mm

× 50 mm)

(soldering land: 6 mm

× 6 mm)

(board thickness: 1.6 t)

⎯

⎯

135

Thermal resistance

(junction to ambient)

Device mounted on a glass-epoxy board

(board size: 50 mm

× 50 mm)

(soldering land: 2.1 mm

× 1.4 mm)

(board thickness: 1.6 t)

⎯

⎯

210

°C/W

Thermal resistance

(junction to lead)

⎯

⎯

⎯

16

°C/W

Unit: mm

JEDEC

―

JEITA

―

TOSHIBA

3-4E1A

Weight: 0.023 g (typ.)