CMF02

2007-04-16

2

Characteristic

Symbol

Test Condition

Min

Typ.

Max

Unit

Peak forward voltage

⎯

⎯

2.0

V

Repetitive peak reverse current

⎯

⎯

50

μA

Reverse recovery time

trr

⎯

⎯

100

ns

Forward recovery time

tfr

⎯

270

⎯

ns

Device mounted on a ceramic board

(board size: 50 mm

× 50 mm)

(soldering land: 2 mm

× 2 mm)

(board thickness: 0.64 t)

⎯

⎯

60

Device mounted on a glass-epoxy

board

(board size: 50 mm

× 50 mm)

(soldering land: 6 mm

× 6 mm)

(board thickness: 1.6 t)

⎯

⎯

135

Thermal resistance

Device mounted on a glass-epoxy

board

(board size: 50 mm

× 50 mm)

(soldering land: 2.1 mm

× 1.4 mm)

(board thickness: 1.6 t)

⎯

⎯

210

°C/W

Thermal resistance (junction to lead)

⎯

⎯

⎯

16

°C/W

Marking

Standard Soldering Pad

Abbreviation Code

Part No.

F2

CMF02

Handling Precautions

Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When

using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance

value.

Refer to the Rectifier databook for further information.

3.0

1.4

Unit: mm

1.4