Data Sheet

LTC9105

OUTLINE DIMENSIONS

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Rev. A | 21 of 22

5.00 ± 0.10

5.00 ± 0.10

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40 ± 0.10

20

19

1

2

BOTTOM VIEW—EXPOSED PAD

2.60 REF

2.70 ± 0.10

0.75 ± 0.05

R = 0.125

TYP

R = 0.05

TYP

0.25 ± 0.05

0.65 BSC

0.200 REF

0.00 – 0.05

(UH20) QFN 0208 REV Ø

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70 ± 0.05

0.25 ± 0.05

0.65 BSC

2.60 REF

2.70 ± 0.05

4.10 ± 0.05

5.50 ± 0.05

PACKAGE

OUTLINE

PIN 1 NOTCH

R = 0.30 TYP

OR 0.35 × 45°

CHAMFER

2.70 ± 0.10

2.70 ± 0.05

Figure 25. UH Package (20-Lead Plastic QFN (5mm × 5mm))