Data Sheet

ADPL40502

analog.com

Rev. 0

14 of 17

PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the

ADPL40502.

Place the input capacitor as close as possible to the VIN and the GND pins. Place the output capacitor as close as

possible to the VOUT and the GND pins. Use of 0402 or 0603 size capacitors and resistors achieves the smallest possible

footprint solution on boards where area is limited.

Figure 27. Example TSOT PCB Layout

Figure 28. Example LFCSP PCB Layout