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TPS830F датащи(PDF) 4 Page - Toshiba Semiconductor

номер детали TPS830F
подробное описание детали  Si Monolithic Photo−IC
PDF  6 Pages
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производитель  TOSHIBA [Toshiba Semiconductor]
домашняя страница  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TPS830F датащи(HTML) 4 Page - Toshiba Semiconductor

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TPS830(F)
2007-10-01
4
Circuit Block Diagram
Bit Pattern Designing Example (reference)
• Example of code signal = 11010010
Sequence of LED signals = 1 must be avoided. If LED signals of 1
sequence, TPS830(F) may not receive LED signals properly. After an LED
signal of 1, 0 must be sent (55μ or longer interval necessary).
Please take this into account when designing a bit pattern.
The following shows the bit pattern t example that is converted at first
code signals to LED signals as shown on the right diagram.
Precautions
1. To stabilize the power line, insert a bypass capacitor of up to 0.01μF between VCC and GND, close to the
device.
2. At power
−on the internal circuit takes about 100μs to stabilize. During this period the output signal is unstable
and may change.
3. To avoid unnecessary oscillation, insert a bypass capacitor of 1000pF between VCC and GND.
4. When using the device, please take the device’s characteristics, the operating environment and the
characteristics of pairing LED device into considerations.
5. Soldering temperature: ≦ 260°C, soldering time : ≦ 5s (Soldering must be performed under the 2mm from
the body of the device.)
6. When forming the leads, bend each lead under the 2mm from the body of the device. Soldering must be
performed after the leads have been formed.
<Conversion example>
Code signal
LED signal
0
00
1
10
62μs
26μs
LED signals
<Pattern example>
Code signals
1
1
1
1
0
0
0
0
1
1
1
1
0
0 0 0
0 0 0 0 0
0 0 0
3. VCC
1. VO
I-V
Preamp.
BPF
AGC
LPF
PD
Average
Envelope
Output
Slicer
2. GND



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