WF5027 series

SEIKO NPC CORPORATION —2

SERIES CONFIGURATION

For Fundamental Oscillator

For 3rd Overtone Oscillator

VERSION NAME

Operating

supply

voltage range

[V]

Output drive

capability

[mA]

PAD layout

Recommended

oscillation

[MHz]

*1. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscilla-

tion frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the

oscillation characteristics of components must be carefully evaluated.

*2. Wafer form devices have designation WF5027

×× and chip form devices have designation CF5027××.

output

output

output

output

output

output

output

1.60 to 3.63

± 4

Flip Chip

Bonding

20 to 60

5027A1

5027A2

5027A3

5027A4

5027A5

5027A6

5027A7

60 to 100

5027AP

5027AQ

5027AR

5027AS

5027AT

5027AV

5027AW

Wire Bonding

Type I

20 to 60

5027B1

5027B2

5027B3

5027B4

5027B5

5027B6

5027B7

60 to 100

5027BP

5027BQ

5027BR

5027BS

5027BT

5027BV

5027BW

Wire Bonding

Type II

20 to 60

5027C1

5027C2

5027C3

5027C4

5027C5

5027C6

5027C7

60 to 100

5027CP

5027CQ

5027CR

5027CS

5027CT

5027CV

5027CW

Operating

supply

voltage range

[V]

Output drive

capability

[mA]

PAD layout

*1. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscilla-

tion frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the

oscillation characteristics of components must be carefully evaluated.

*2. Wafer form devices have designation WF5027

×× and chip form devices have designation CF5027××.

Versions in parentheses ( ) are under development.

40 to 50

50 to 65

65 to 85

85 to 110

110 to 145

145 to 180

1.60 to 3.63

± 8

Flip Chip Bonding

5027MA

5027MB

5027MC

5027MD

(5027QE)

(5027QF)

Wire Bonding Type I

5027NA

5027NB

5027NC

5027ND

(5027RE)

(5027RF)

Wire Bonding Type II

5027PA

5027PB

5027PC

5027PD

(5027SE)

(5027SF)

Device

Package

Version name

WF5027

××–4

Wafer form

CF5027

××–4

Chip form

WF5027

−4

Oscillation frequency range, frequency divider function

Pad layout type

Form

A, M, Q: for Flip Chip Bonding

B, N, R: for Wire Bonding (type I)

C, P, S: for Wire Bonding (type II)

WF: Wafer form

CF: Chip (Die) form