ESS Technology, Inc.

SAM0660-080406

3

ES4810SAA PRODUCT BRIEF

P C BOARD LAYOUT CONSIDERATIONS

PRELIMINARY

P C BOARD LAYOUT CONSIDERATIONS

Required Printed Circuit Board Layout

The ES4810 LQFP package requires additional heat

sinking to prevent heat-caused damage to the chip. To

accomplish this heat dissipation in an economical manner,

the following printed circuit board (PCB) layout is required.

The land pattern for the chips still use the standard 208-pin

LQFP footprint on the PCB with the addition of the heat

sink, as shown in Figure 3. Required for heat dissipation is

the addition of a solid copper fill on the top and bottom

layers of the PCB, along with 1mm square solder mask

exposures and via in the center of each exposure.

The metal land on the underside of the IC must have more

than 90% of its surface area directly soldered onto the

PCB (i.e., the solder mask openings as shown below) for

the heat dissipation to be effective.

It is not recommended to route any traces between the

land pattern and metal land.

The specifications for the LQFP heat sinking is listed in

Table 1

Figure 3 Required PCB Layout for Heat Dissipation

Table 1

LQFP Heat Sink Specifications

Parameters

Dimensions

Parameters

Dimensions

PCB Layers

4, minimum

Via diameter

0.3 mm

Solder mask opening (top layer)

1.0

× 1.0 mm

Via spacing (center to center)

1.2 mm

Solder mask width

0.2 mm

Via plating

must be plugged

VIA, 0.3 dia.

solder mask (top layer)

solder mask opening (top layer)

SAM0508-03

0.2

1.0

1.2

0.2

0.2

0.2

1.0

1.2

Dimensions

in mm

7.4

7.4