TEWS TECHNOLOGIES GmbH keeps the right to change technical specification without further notice.

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Issue 1.0.4

2018-01-25

TEWS TECHNOLOGIES GmbH

Am Bahnhof 7

25469 Halstenbek, Germany

Phone: +49 (0) 4101 4058 0

Fax: +49 (0) 4101 4058 19

e-mail: info@tews.com

www.tews.com

The Embedded I/O Company

Technical Information

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Form Factor: Standard single width XMC

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Board size: 149 mm x 74 mm

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PCI Express x4 Link (Base Specification 1.1)

compliant interface conforming to ANSI/VITA

42.3-2006

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IPMI resource: FRU hardware definition

information stored in on-board EEPROM

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TXMC638 FPGA options:

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-10R Xilinx XC7K160T-2FBG676I Kintex-7

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-11R Xilinx XC7K325T-2FBG676I Kintex-7

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-12R Xilinx XC7K410T-2FBG676I Kintex-7

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Serial Flash for FPGA Configuration

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FPGA clock options:

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Local clock generator as source for the

FPGA internal PLL

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Free programmable Si514 Oscillator

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DDR3 SDRAM bank, 256M x 32 Bit (1GB)

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Front I/O lines

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24 differential analog inputs

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16 bit resolution

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5Msps

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Factory calibration

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Back I/O lines

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64 single ended or 32 differential back I/O

lines on rear connector P14.

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4 FPGA Multi-Gigabit-Transceiver on rear

connector P16

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Operating temperature -40°C to +85°C

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MTBF (MIL-HDBK217F/FN2 GB 20°C): 269000

Block Diagram TXMC638