Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Typical Time to Trip at 23 ˚C

0.01

0.1

0.001

1

10

100

1

10

Fault Current (Amps)

MF-SMHT136

MF-SMHT160

MF-SMHT SERIES, REV. D, 08/05

Solder Reflow Recommendations

160–220

300

250

200

150

100

50

0

10–20

120

Preheating

Soldering

Cooling

Time (seconds)

Solder reflow

• Recommended reflow methods: IR, vapor phase oven, hot air oven.

• Devices are not designed to be wave soldered to the bottom side of the

board.

• Gluing the devices is not recommended.

• Recommended maximum paste thickness is 0.25 mm (.010 inch).

• Devices can be cleaned using standard industry methods and solvents.

Note:

• If reflow temperatures exceed the recommended profile, devices may not

meet the performance requirements.

Rework

• A device should not be reworked.

The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications

may differ from these values due to the influence of other variables.