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Issue 1.0.0

2020-07-20

TEWS TECHNOLOGIES GmbH

Am Bahnhof 7

25469 Halstenbek, Germany

Phone: +49 (0) 4101 4058 0

Fax: +49 (0) 4101 4058 19

e-mail: info@tews.com

www.tews.com

The Embedded I/O Company

TCPS275 3U CompactPCI Serial XMC Module Carrier

TCPS275-10R

Application Information

The TCPS275 is a PICMG CPCI-S.0 R2.0 compatible 3U

module that provides one slot for a single-width XMC

module used to build modular, flexible and cost effective

I/O solutions for all kinds of applications like process

control, medical systems, telecommunication and traffic

control.

The TCPS275 is a versatile solution to upgrade well

known XMC I/O solutions to the CompactPCI Serial

standard.

The PCI Express x4 link from the host board to the XMC

module is enhanced by a PCIe Gen3 Redriver, allowing

safe operation of XMC modules in distributed PCIe

systems.

The TCPS275 supports XMC front panel I/O.

VPWR is 12 V for all variants.

Technical Information

 Form Factor: 3U CPCI-S.0 R2.0

 Board size: 160 mm x 100 mm

 One XMC site conforming to VITA 42.3

 PCIe Interface: x4, Rev. 3.0

 12 V VPWR

 XMC Front Panel I/O

 Operating temperature -40°C to +85°C

 MTBF (MIL-HDBK217F/FN2 GB 20°C)

TCPS275-10R: 1026000 h