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CMOS High Voltage Logic – CD4081B

Rev 1.0

21/11/17

PARAMETER

SYMBOL

MIN

MAX

UNITS

Supply Voltage

VDD

3.0

18

V

DC Input Voltage, Output Voltage

VIN, VOUT

0

VDD

V

Operating Temperature Range

TJ

-55

+125

°C

Recommended Operating Conditions3 (Voltages referenced to V

SS)

Absolute Maximum Ratings1

PARAMETER

SYMBOL

VALUE

UNIT

DC Supply Voltage (Referenced to VSS)

VDD

-0.5 to +20

V

DC Input or Output Voltage(Referenced to VSS)

VIN, VOUT

-0.5 to VDD+0.5

V

Storage Temperature Range

TSTG

-65 to 150

°C

Input Current or Output Current (per Pad)

IIN, IOUT

±10

mA

Power Dissipation in Still Air

2

PD

750

mW

 

DC Electrical Characteristics (Voltages referenced to V

SS)

LIMITS

PARAMETER

SYMBOL

VDD

CONDITIONS

25°C

85°C

FULL RANGE

4

UNITS

5V

VOUT = 0.5 or VDD -0.5

3.5

3.5

3.5

10V

VOUT = 1.0 or VDD -1.0

7

7

7

Minimum High-

Level Input

Voltage

VIH

15V

VOUT = 1.5 or VDD -1.5

11

11

11

V

5V

VOUT = 0.5V

1.5

1.5

1.5

10V

VOUT = 1.0V

3

3

3

Maximum Low-

Level Input

Voltage

VIL

15V

VOUT = 1.5V

4

4

4

V

5V

4.95

4.95

4.95

10V

9.95

9.95

9.95

Minimum High-

Level Output

Voltage

VOH

15V

VIN = VDD

14.95

14.95

14.95

V

5V

0.05

0.05

0.05

10V

0.05

0.05

0.05

Maximum Low-

Level Output

Voltage

VOL

15V

VIN = VDD or VSS

0.05

0.05

0.05

V

Maximum Input

Leakage

Current

IIN

18V

VIN = VDD or VSS

±0.1

±.0.1

±1.0

µA

5V

0.25

7.5

7.5

10V

0.5

15

15

15V

1.0

30

30

Maximum

Quiescent

Supply Current

IDD

20V

VIN = VDD or VSS

IOUT = 0µA

5.0

150

150

µA

3.  This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken

to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be

constrained to the range VSS ≤ (VIN or VOUT) ≤ VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD).

Unused outputs must be left open.

1.  Operation above the absolute maximum rating may cause device failure. Operation at the absolute maximum ratings, for extended periods, may

reduce device reliability. 2. Measured in plastic DIP package, results in die form are dependent on die attach and assembly method.