CPC1580

11

For additional information please visit our website at: www.clare.com

Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and

product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,

Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for

a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental

damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-CPC1580-R00G

©Copyright 2007, Clare, Inc.

All rights reserved. Printed in USA.

8/17/07

7. Manufacturing Information

7.1 Soldering

For proper assembly, the component must be

processed in accordance with the current revision of

IPC/JEDEC standard J-STD-020. Failure to follow the

recommended guidelines may cause permanent

damage to the device resulting in impaired

performance and/or a reduced lifetime expectancy.

7.2 Washing

Clare does not recommend ultrasonic cleaning or the

use of chlorinated hydrocarbons.

7.3 Mechanical Dimensions

7.4 Tape and Reel Specification

8 Pin Flatpack Package

9.398 ± 0.127

(0.370 ± 0.005)

6.350 ± 0.127

(0.250 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

8.077 ± 0.127

(0.318 ± 0.005)

7.620 ± 0.254

(0.300 ± 0.010)

2.159 TYP.

(0.085 TYP.)

2.286 MAX.

(0.090 MAX.)

0.203

(0.008)

0.635 ± 0.127

(0.025 ± 0.005)

9.652 ± 0.381

(0.380 ± 0.015)

0.457 ± 0.076

(0.018 ± 0.003)

2.159 TYP.

(0.085 TYP.)

Recommended PCB Land Pattern

Dimensions

mm

(inches)

2.54

(0.10)

8.70

(0.3425)

1.55

(0.0610)

0.65

(0.0255)

Tape and Reel Packaging for 8 Pin Flatpack Package

User Direction of Feed

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)

18

K

(0.079)

Top Cover

Tape

K

(0.106)

P = 12.00

(0.472)

W = 16.30 max

(0.642 max)

Bo = 10.30

(0.406)

Ao = 10.30

(0.406)

NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2

Dimensions

mm

(inches)