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PACKING LIST

OPTIONAL ITEMS

ORDERING INFORMATION

Model Name

P/N

CPU

Memory eMMC LVDS/eDP TPM 2.0 Thermal Operating Temp.

ASL9A2-TC16-7835RE 770-ASL9A21-000G Intel® Atom Processor x7835RE, 8 Cores, 12W

16GB

64GB eDP

N/A

Cooler

-40 to 85°C

ASL9A2-TC16-7433RE 770-ASL9A21-100G Intel® Atom Processor x7433RE, 4 Cores, 9W

16GB

64GB eDP

N/A

Cooler

-40 to 85°C

ASL9A2-TC86-7213RE 770-ASL9A21-200G Intel® Atom Processor x7213RE, 2 Cores, 9W

8GB

64GB LVDS

N/A

Cooler

-40 to 85°C

ASL9A2-TC86-7211RE 770-ASL9A21-300G Intel® Atom Processor x7211RE, 2 Cores, 6W

8GB

64GB LVDS

N/A

Cooler

-40 to 85°C

Cooler

A71-108305-000G

Heat Spreader

A71-808364-000G

COM335 Carrier Board Kit

770-CM3351-000G

DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your

sales representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © October 18, 2024 DFI Inc.

SPECIFICATION

SYSTEM

Processor

Intel® Atom x7000RE series processors (Code Name : Amston Lake)

Intel® Atom Processor x7835RE, 8 Cores, 1.3~3.6GHz, 12W

Intel® Atom Processor x7433RE, 4 Cores, 1.5~3.4GHz, 9W

Intel® Atom Processor x7213RE, 2 Cores, 2.0~3.4GHz, 9W

Intel® Atom Processor x7211RE, 2 Cores, 1.0~3.2GHz, 6W

Memory

LPDDR5 up to 16GB

Dual Channel LPDDR5 4800MHz

8GB/16GB supported by project basis.

In-band ECC (IBECC) Supported by all CPU SKUs

BIOS

AMI SPI 256Mbit

GRAPHICS

Controller

Intel® UHD

Feature

Open GL 4.6, DirectX 12.1 Vulkan 1.2 (Windows)

Mesa 3D, Open GL 4.6, Vulkan 1.2 (Linux)

HW Decode: 4K60 10b 4:2:0, 4:4:4 HEVC/VP9/SCC, 4K60 10b 4:2:0 AV1

HW Encode: 4K60 10b 4:2:0, 4:4:4 HEVC/VP9/SCC

Display

1 x DDI

1 x LVDS/eDP

LVDS: single channel 24-bit, resolution up to 1920x1200 @ 60Hz

eDP: resolution up to 4096x2160 @ 60Hz

HDMI: resolution up to 4096x2160 @ 30Hz

DP++: resolution up to 4096x2160 @ 60Hz, 3840x2160 @60Hz

Dual Displays

DDI + LVDS/eDP

EXPANSION

Interface

4 x PCIe x1 (Gen 3)

1 x I2C

1 x SMBus

1 x LPC

1 x SNDW (available upon request)

1 x GSPI

2 x UART (TX/RX)

1 x CAN bus (available upon request)

AUDIO

Interface

HD Audio

ETHERNET

Controller

1 x Intel® I226-IT / I226-LM (10/100/1000Mbps/2.5Gbps)

I/O

USB

2 x USB 3.2 Gen2

8 x USB 2.0

SATA

2 x SATA 3.0 (up to 6Gb/s)

eMMC

1 x 8GB/16GB/32GB/64GB/128GB eMMC 5.1 (available upon request)

DIO

1 x 8-bit DIO

WATCHDOG TIMER

Output & Interval

System Reset, Programmable via Software from 1 to 255 Seconds

SECURITY

TPM

dTPM or fTPM (Optional)

POWER

Type

4.75V~20V, 5VSB, VCC_RTC (ATX mode)

4.75V~20V, VCC_RTC (AT mode)

Consumption

TBD

OS SUPPORT

OS Support

(UEFI Only)

Windows 11/10 IoT Enterprise 64-bit

Linux

ENVIRONMENT

Temperature

Operating: -40 to 85°C

Storage: -40 to 85°C

Humidity

Operating: 5 to 90% RH

Storage: 5 to 90% RH

MTBF

TBD

MECHANISM

Dimensions

COM Express® Mini

84mm (3.3") x 55mm (2.16")

Compliance

PICMG COM Express® R3.1, Type 10

STANDARDS AND

CERTIFICATIONS

Certifications

CE, FCC