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TLE202X датащи(PDF) 4 Page - Texas Instruments |
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TLE202X датащи(HTML) 4 Page - Texas Instruments |
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4 / 72 page ![]() TLE202x, TLE202xA, TLE202xB, TLE202xY EXCALIBUR HIGHSPEED LOW POWER PRECISION OPERATIONAL AMPLIFIERS SLOS191C − FEBRUARY 1997 − REVISED APRIL 2007 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLE2021Y chip information This chip, when properly assembled, display characteristics similar to the TLE2021. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax= 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + − OUT IN + IN − VCC+ (7) (3) (2) (6) (4) VCC −/GND (1) (5) OFFSET N1 OFFSET N2 78 54 (1) (2) (3) (4) (5) (6) (7) |
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