HTG2190 datasheet(4/50 Pages) HOLTEK

4 / 50 page

Pad Assignment

Chip size: 3420

´ 3855 (mm)

* The IC substrate should be connected to VSS in the PCB layout artwork.

Pad Coordinates

Unit:

Pad No.

-1561.08

1781.81

1214.37

-1797.56

-1577.85

1535.18

1156.72

-1465.33

-1577.85

1428.50

1331.47

-1797.56

-1577.85

1322.07

1442.47

-1797.56

-1577.85

1215.39

1559.56

-1797.56

-1577.85

1108.96

1264.67

-1465.33

-1577.85

1002.28

1492.25

-1516.38

-1577.85

895.86

1492.25

-1404.62

HTG2190

Rev. 1.20

July 5, 2002

5 8

5 9

6 0

6 1

6 2

6 3

6 4

6 5

6 6

1 0

6 7

1 1

6 8

1 2

6 9

1 3

7 0

1 4

7 1

1 5

7 2

1 6

7 3

1 7

7 4

1 8

7 5

1 9

7 6

2 0

7 7

2 1

7 8

2 2

7 9

2 3

8 0

2 4

8 1

2 5

8 2

2 6

8 3

2 7

8 4

2 8

8 5

2 9

8 6

3 0

8 7

3 1

8 8

3 2

8 9

3 3

9 0

3 4

9 1

3 5

9 2

3 6

9 3

3 7

9 4

3 8

9 5

3 9

9 6

4 0

9 7

4 1

9 8

4 2

9 9

4 4 4 5 4 6 4 7 4 8 4 9 5 0 5 1 5 2 5 3 5 4 5 5 5 6 5 7

( 0 , 0 )

4 3

1 0 0

1 0 1

1 0 2

1 0 3

1 0 4

1 0 5

1 0 6

1 0 7

1 0 8

1 0 9

1 1 0

1 1 1

1 1 2

1 1 3

1 1 4

S E G 3 5

S E G 3 4

S E G 3 3

S E G 3 2

S E G 3 1

S E G 3 0

S E G 2 9

S E G 2 8

S E G 2 7

S E G 2 6

S E G 2 5

S E G 2 4

S E G 2 3

S E G 2 2

S E G 2 1

S E G 2 0

S E G 1 9

S E G 1 8

S E G 1 7

S E G 1 6

S E G 1 5

S E G 1 4

S E G 1 3

S E G 1 2

S E G 1 1

S E G 1 0

S E G 9

S E G 8

S E G 7

S E G 6

T R I M 1

T R I M 3

T R I M 4

T R I M 2

O S C O

V S S

P A 0

P A 1

P A 2

P A 3

P A 4

P A 5

P A 6

P A 7

P B 2

P B 3

P B 4 / S O U T

P B 5 / S C L K

P B 6 / T M R 1 / R T .

P B 7 / T M R 0

P B 0 / P W M 1

P W M 2 / A U D

R E S

I N T / S I N

V D D

O S C I

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